PCB Manufacturing Capability
PCB board
PCB Proofing / 12 Hours Expedited / 72 Hours Expedited
Multi/single panel, double panel, four-layer panel, aluminum substrate
High-precision boards, FPC flexible boards, and aluminum-based PCB boards are available
PCB 加工能力
| 整体加工能力 | ||
| No | 項目(Item) | 制程能力(Capability) |
| 1 | 層數 | 1 – 12 (Layer) |
| 2 | 最大板厚 | 110 mil (2.8 mm) |
| 3 | 最小板厚 | 双面板 2 Layers : 8 mil (0.2 mm) |
| 四层板 4 Layers : 16 mil (0.4 mm) | ||
| 六层板 6 Layers : 24 mil (0.6 mm) | ||
| 八层板以上( ≧ 8 Layers ) : 32 mil (0.8 mm) | ||
| 4 | 成品板厚公差 | 板厚( Board Thickness ) ≧ 0.8mm : ± 10% |
| 0.4mm≧板厚( Board Thickness ) < 0.8mm : ±3mil(0.075mm) | ||
| 5 | 板面平坦度 | 小于对角线( Diagonal length of less than )0.7% |
| 尺寸 | ||
| No | 項目(Item) | 能力(Capability) |
| 1 | 成品尺寸 | 最大 (Max) ：16.0 “×21.0 ” (406mm×533mm) |
| 最小 (Min) ： 1.95 “×1.95 ” (10mm×10mm) | ||
| 2 | 尺寸公差 | 沖模邊到邊 Punching Edge to Edge : 8 mil (0.2mm) |
| 沖模孔到邊 Punching Hole to Edge : 4mil (0.1mm) | ||
| 成型邊到邊 Routing Edge to Edge : 4 mil (0.1mm) | ||
| 成型孔到邊 Routing Hole to Edge : 2mil (0.05mm) | ||
| 3 | 槽孔公差 | 成型最小槽寬 Min Slot Width(CNC) : 32mil (0.8mm) |
| 鑽孔最小槽寬 Min Slot Width(DRL) : 20mil (0.5mm) | ||
| 槽寬公差鍍通孔 Slot Tolerance (PTH) : ± 4mil ( ± 0.10mm) | ||
| 槽寬公差非鍍通孔 Slot Tolerance (NPTH) : ± 3mil ( ± 0.076mm) | ||
| 4 | V-Cut公差 | 切割殘厚公差 V-Cut Remaining Thickness Tolerance : ± 4mil ( ± 0.1mm) |
| 切割上下刀公差 V-Cut Misregistration Tolerance : ± 4mil ( ± 0.1mm) | ||
| 最小切割板厚 V-Cut Board Thickness that Can be V-Cut (Min) : 24mil(0.6mm) | ||
| 切割角度公差 V-Cut Angle Tolerance : ± 5° | ||
| 切割線到孔公差V-Cut to Hole Tolerance : ±6mil (±0.15mm) | ||
| 切割線到切割線公差V-Cut to V-Cut Position Tolerance : ±5mil ( ±0.127mm) | ||
| 孔 | ||
| No | 項目(Item) | 技術能力(Capability) |
| 1 | 孔徑公差 | 鍍通孔 ( PTH ) : ± 3mil ( ±0.076mm) |
| 非鍍通孔 ( NPTH ) : ± 2mil ( ±0.05mm) | ||
| 2 | 成品孔徑 | 最小孔徑 Min Hole Diameter : 8mil ( 0.2 mm) |
| 最大孔徑 (鑽孔)Max Hole Diameter:(DRL) : 250mil ( 6.35 mm) | ||
| 最大孔徑 (成型)Max Hole Diameter:(CNC) : ≧ 55mil (≧ 1.1 mm) | ||
| 3 | 孔位公差 | ± 2mil ( ± 0.05mm) |
| 4 | 鍍孔縱橫比 | 板厚/孔徑 ( Board Thickness /Hole Diameter ) = 8 : 1 |
| 5 | 最小間距(孔到孔) | ± 14mil ( 0.35 mm) |
| 6 | 樹脂塞孔 | 鍍通孔 ( PTH ) : 8mil~16mil ( 0.2mm ~ 0.4mm) |
| 線路 | ||
| No | 項目(Item) | 技術能力(Capability) |
| 1 | 外層最小線寬距 | H/HOZ 4mil/4mil (0.1mm/0.1mm) |
| 1/1OZ 5mil/5mil (0..127mm/0.127mm ) | ||
| 2/2OZ 6mil/6mil (0.152mm/0.152mm ) | ||
| 2 | 內層最小線寬距 | H/HOZ 3mil/3mil (0.076mm /0.076mm) |
| 1/1OZ 4mil/4mil (0.102mm/ 0.102mm) | ||
| 2/2OZ 5mil/5mil (0.127mm/0.127mm) | ||
| 3 | 線寬距公差(蝕刻後) | H/H OZ ±10% |
| 1/1 OZ ±20％ | ||
| 4 | 阻抗控制 | ±10% |
| 5 | 最小孔環設計 | 5mil ( 0.125mm) |
| 層對層精準度 | ±4mil (0.1mm) | |
| 線路對準度 | ±2mil (0.05mm) | |
| 防焊 | ||
| No | 項目(Item) | 技術能力(Capability) |
| 1 | 塞孔孔徑 | ≦ 20mil (0.5mm) |
| 2 | 最小隔焊 | 防焊顏色 Solder Mask Color : |
| 黑色 Black : 8mil (0.2mm) | ||
| 白色 White : 8mil (0.2mm) | ||
| 深綠色 Bottle green : 5mil (0.125mm) | ||
| 其他色系 Other color department : 3mil (0.076mm) | ||
| 3 | 防焊窗最小寬度 | 5mil (0.125mm) |
| 4 | 文字符號最小寬度 | 防焊 Solder Mask : 8mil(0.2mm) |
| 文字 Silk Screen : 5mil(0.125mm) | ||
| 5 | 文字符號對準度 | 防焊 Solder Mask : ±4mil (0.1mm) |
| 文字 Silk Screen : ±6mil (0.15mm) | ||
| 6 | 防焊對位度 | ±2mil (0.05mm) |
Created on：2022-11-08 07:51
넶PV：0
